{"id":1946,"date":"2026-03-25T11:05:03","date_gmt":"2026-03-25T04:05:03","guid":{"rendered":"https:\/\/makipos.com\/?p=1946"},"modified":"2026-03-31T14:24:45","modified_gmt":"2026-03-31T07:24:45","slug":"what-is-in-circuit-testing-ict","status":"publish","type":"post","link":"https:\/\/makipos.com\/what-is-in-circuit-testing-ict\/","title":{"rendered":"In-Circuit Testing (ICT): What It Is and How It Compares to Other Methods"},"content":{"rendered":"<p><em>In PCB manufacturing, post-assembly testing plays a critical role in ensuring product quality. In-Circuit Testing (ICT) is one of the most widely used methods for quickly and accurately checking components and connections on a circuit board. As a result, ICT can detect defects early in the production process before the board moves on to further testing stages. In this article, we will explore what ICT is and how it differs from other testing methods.<\/em><\/p>\n<div id=\"ez-toc-container\" class=\"ez-toc-v2_0_79_2 counter-hierarchy ez-toc-counter ez-toc-grey ez-toc-container-direction\">\n<div class=\"ez-toc-title-container\">\n<p class=\"ez-toc-title\" style=\"cursor:inherit\">M\u1ee5c l\u1ee5c<\/p>\n<span class=\"ez-toc-title-toggle\"><a href=\"#\" class=\"ez-toc-pull-right ez-toc-btn ez-toc-btn-xs ez-toc-btn-default ez-toc-toggle\" aria-label=\"Toggle Table of Content\"><span class=\"ez-toc-js-icon-con\"><span class=\"\"><span class=\"eztoc-hide\" style=\"display:none;\">Toggle<\/span><span class=\"ez-toc-icon-toggle-span\"><svg style=\"fill: #999;color:#999\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\" class=\"list-377408\" width=\"20px\" height=\"20px\" viewBox=\"0 0 24 24\" fill=\"none\"><path d=\"M6 6H4v2h2V6zm14 0H8v2h12V6zM4 11h2v2H4v-2zm16 0H8v2h12v-2zM4 16h2v2H4v-2zm16 0H8v2h12v-2z\" fill=\"currentColor\"><\/path><\/svg><svg style=\"fill: #999;color:#999\" class=\"arrow-unsorted-368013\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\" width=\"10px\" height=\"10px\" viewBox=\"0 0 24 24\" version=\"1.2\" baseProfile=\"tiny\"><path d=\"M18.2 9.3l-6.2-6.3-6.2 6.3c-.2.2-.3.4-.3.7s.1.5.3.7c.2.2.4.3.7.3h11c.3 0 .5-.1.7-.3.2-.2.3-.5.3-.7s-.1-.5-.3-.7zM5.8 14.7l6.2 6.3 6.2-6.3c.2-.2.3-.5.3-.7s-.1-.5-.3-.7c-.2-.2-.4-.3-.7-.3h-11c-.3 0-.5.1-.7.3-.2.2-.3.5-.3.7s.1.5.3.7z\"\/><\/svg><\/span><\/span><\/span><\/a><\/span><\/div>\n<nav><ul class='ez-toc-list ez-toc-list-level-1 ' ><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-1\" href=\"https:\/\/makipos.com\/what-is-in-circuit-testing-ict\/#1_What_is_In-Circuit_Testing_ICT\" >1. What is In-Circuit Testing (ICT)?<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-2\" href=\"https:\/\/makipos.com\/what-is-in-circuit-testing-ict\/#2_What_does_ICT_check\" >2. What does ICT check?<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-3\" href=\"https:\/\/makipos.com\/what-is-in-circuit-testing-ict\/#3_How_does_ICT_work\" >3. How does ICT work?<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-4\" href=\"https:\/\/makipos.com\/what-is-in-circuit-testing-ict\/#4_Advantages_and_limitations_of_ICT\" >4. Advantages and limitations of ICT<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-5\" href=\"https:\/\/makipos.com\/what-is-in-circuit-testing-ict\/#5_How_is_ICT_different_from_other_testing_methods\" >5. How is ICT different from other testing methods?<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-6\" href=\"https:\/\/makipos.com\/what-is-in-circuit-testing-ict\/#6_When_should_ICT_be_used\" >6. When should ICT be used?<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-7\" href=\"https:\/\/makipos.com\/what-is-in-circuit-testing-ict\/#Conclusion\" >Conclusion<\/a><\/li><\/ul><\/nav><\/div>\n<h2 data-start=\"64\" data-end=\"104\"><span class=\"ez-toc-section\" id=\"1_What_is_In-Circuit_Testing_ICT\"><\/span>1. What is In-Circuit Testing (ICT)?<span class=\"ez-toc-section-end\"><\/span><\/h2>\n<p data-start=\"106\" data-end=\"396\">In-Circuit Testing (ICT) is a method used to test electronic circuit boards after PCB assembly (PCBA), with the aim of checking individual components and connections on the board. This method helps identify issues such as incorrect component values, soldering defects, or connection faults.<\/p>\n<p data-start=\"398\" data-end=\"665\">Unlike Functional Testing (FCT), which verifies the overall operation of the board, ICT focuses on individual components at the component level. The testing process is typically carried out by measuring voltage, current, or signals at specific test points on the PCB.<\/p>\n<p data-start=\"667\" data-end=\"800\" data-is-last-node=\"\" data-is-only-node=\"\">ICT is widely used in mass production thanks to its ability to perform fast testing and detect defects early in the assembly process.<\/p>\n<figure id=\"attachment_1947\" aria-describedby=\"caption-attachment-1947\" style=\"width: 1125px\" class=\"wp-caption aligncenter\"><img loading=\"lazy\" decoding=\"async\" class=\"size-full wp-image-1947\" src=\"https:\/\/makipos.com\/wp-content\/uploads\/2026\/03\/circuit-testing-ict.webp\" alt=\"In-Circuit Testing (ICT)\" width=\"1125\" height=\"630\" srcset=\"https:\/\/makipos.com\/wp-content\/uploads\/2026\/03\/circuit-testing-ict.webp 1125w, https:\/\/makipos.com\/wp-content\/uploads\/2026\/03\/circuit-testing-ict-300x168.webp 300w, https:\/\/makipos.com\/wp-content\/uploads\/2026\/03\/circuit-testing-ict-1024x573.webp 1024w, https:\/\/makipos.com\/wp-content\/uploads\/2026\/03\/circuit-testing-ict-768x430.webp 768w\" sizes=\"auto, (max-width: 1125px) 100vw, 1125px\" \/><figcaption id=\"caption-attachment-1947\" class=\"wp-caption-text\">In-Circuit Testing (ICT)<\/figcaption><\/figure>\n<h2 data-start=\"75\" data-end=\"102\"><span class=\"ez-toc-section\" id=\"2_What_does_ICT_check\"><\/span>2. What does ICT check?<span class=\"ez-toc-section-end\"><\/span><\/h2>\n<p data-start=\"104\" data-end=\"245\">In-Circuit Testing (ICT) focuses on checking individual components and connections on the PCB after assembly to detect manufacturing defects.<\/p>\n<p data-start=\"247\" data-end=\"312\">During the testing process, ICT typically includes the following:<\/p>\n<ul data-start=\"314\" data-end=\"914\">\n<li data-section-id=\"10meh1q\" data-start=\"314\" data-end=\"455\"><strong data-start=\"316\" data-end=\"337\">Component values:<\/strong> check whether components such as resistors, capacitors and diodes have the correct values according to the design.<\/li>\n<li data-section-id=\"1hy8m1p\" data-start=\"456\" data-end=\"563\"><strong data-start=\"458\" data-end=\"495\">Circuit connections (open\/short):<\/strong> detect open circuits or short circuits between connection points.<\/li>\n<li data-section-id=\"e78cpe\" data-start=\"564\" data-end=\"676\"><strong data-start=\"566\" data-end=\"588\">Soldering defects:<\/strong> identify issues such as insufficient solder, poor solder joints, or weak connections.<\/li>\n<li data-section-id=\"1vvvuu8\" data-start=\"677\" data-end=\"797\"><strong data-start=\"679\" data-end=\"709\">Basic voltage and current:<\/strong> measure electrical parameters to ensure the circuit works correctly at a basic level.<\/li>\n<li data-section-id=\"xqrojx\" data-start=\"798\" data-end=\"914\"><strong data-start=\"800\" data-end=\"826\">Component orientation:<\/strong> check whether components are placed in the correct direction (for diodes, ICs, &#8230;).<\/li>\n<\/ul>\n<p data-start=\"916\" data-end=\"1038\" data-is-last-node=\"\" data-is-only-node=\"\">ICT helps detect component and assembly-related defects early, reducing errors before moving on to further testing stages.<\/p>\n<h2 data-start=\"60\" data-end=\"85\"><span class=\"ez-toc-section\" id=\"3_How_does_ICT_work\"><\/span>3. How does ICT work?<span class=\"ez-toc-section-end\"><\/span><\/h2>\n<p data-start=\"87\" data-end=\"178\">ICT works by directly measuring components and connections on the PCB using a test fixture.<\/p>\n<p data-start=\"180\" data-end=\"381\">During testing, the board is placed into a fixture (jig) with multiple contact points called pogo pins. These pins touch the test points on the PCB to perform electrical measurements and signal checks.<\/p>\n<p data-start=\"383\" data-end=\"418\">The ICT process typically includes:<\/p>\n<ul data-start=\"420\" data-end=\"807\">\n<li data-section-id=\"j4phjs\" data-start=\"420\" data-end=\"502\"><strong data-start=\"422\" data-end=\"451\">Contact with test points:<\/strong> pogo pins connect to the test points on the PCB.<\/li>\n<li data-section-id=\"16i76ao\" data-start=\"503\" data-end=\"601\"><strong data-start=\"505\" data-end=\"528\">Apply test signals:<\/strong> the system sends signals or current to different parts of the circuit.<\/li>\n<li data-section-id=\"rxyf55\" data-start=\"602\" data-end=\"696\"><strong data-start=\"604\" data-end=\"633\">Measurement and analysis:<\/strong> voltage, current, or responses from components are measured.<\/li>\n<li data-section-id=\"r2z2m4\" data-start=\"697\" data-end=\"807\"><strong data-start=\"699\" data-end=\"736\">Comparison with reference values:<\/strong> results are compared with design specifications to identify defects.<\/li>\n<\/ul>\n<p data-start=\"809\" data-end=\"940\" data-is-last-node=\"\" data-is-only-node=\"\">ICT often uses a \u201cbed of nails\u201d structure, allowing multiple test points to be checked quickly at the same time in mass production.<\/p>\n<figure id=\"attachment_1948\" aria-describedby=\"caption-attachment-1948\" style=\"width: 1125px\" class=\"wp-caption aligncenter\"><img loading=\"lazy\" decoding=\"async\" class=\"size-full wp-image-1948\" src=\"https:\/\/makipos.com\/wp-content\/uploads\/2026\/03\/ICT-process.webp\" alt=\"ICT processes\" width=\"1125\" height=\"630\" srcset=\"https:\/\/makipos.com\/wp-content\/uploads\/2026\/03\/ICT-process.webp 1125w, https:\/\/makipos.com\/wp-content\/uploads\/2026\/03\/ICT-process-300x168.webp 300w, https:\/\/makipos.com\/wp-content\/uploads\/2026\/03\/ICT-process-1024x573.webp 1024w, https:\/\/makipos.com\/wp-content\/uploads\/2026\/03\/ICT-process-768x430.webp 768w\" sizes=\"auto, (max-width: 1125px) 100vw, 1125px\" \/><figcaption id=\"caption-attachment-1948\" class=\"wp-caption-text\">ICT processes<\/figcaption><\/figure>\n<h2 data-start=\"136\" data-end=\"176\"><span class=\"ez-toc-section\" id=\"4_Advantages_and_limitations_of_ICT\"><\/span><strong data-start=\"136\" data-end=\"176\">4. Advantages and limitations of ICT<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h2>\n<p data-start=\"178\" data-end=\"357\">In-Circuit Testing (ICT) is an effective testing method in PCBA manufacturing, especially after assembly. However, besides its benefits, ICT also has some limitations to consider.<\/p>\n<p><strong data-start=\"361\" data-end=\"376\">&#8211; Advantages:<\/strong><\/p>\n<ul>\n<li data-section-id=\"bhw6vv\" data-start=\"378\" data-end=\"455\"><strong data-start=\"380\" data-end=\"410\">Fast and accurate testing:<\/strong> can check many components in a short time.<\/li>\n<li data-section-id=\"vor4fi\" data-start=\"456\" data-end=\"567\"><strong data-start=\"458\" data-end=\"485\">Early defect detection:<\/strong> helps identify component, soldering and connection issues right after assembly.<\/li>\n<li data-section-id=\"1xwv9m8\" data-start=\"568\" data-end=\"657\"><strong data-start=\"570\" data-end=\"603\">Suitable for mass production:<\/strong> optimized for automated processes with high volume.<\/li>\n<li data-section-id=\"q2ymr7\" data-start=\"658\" data-end=\"751\"><strong data-start=\"660\" data-end=\"681\">High consistency:<\/strong> once the fixture is set up, test results are stable and repeatable.<\/li>\n<\/ul>\n<p data-start=\"753\" data-end=\"771\">&#8211; <strong data-start=\"755\" data-end=\"771\">Limitations:<\/strong><\/p>\n<ul data-start=\"773\" data-end=\"1130\">\n<li data-section-id=\"1ichhyn\" data-start=\"773\" data-end=\"845\"><strong data-start=\"775\" data-end=\"797\">High fixture cost:<\/strong> requires a dedicated jig for each PCB design.<\/li>\n<li data-section-id=\"155y1dg\" data-start=\"846\" data-end=\"957\"><strong data-start=\"848\" data-end=\"874\">No functional testing:<\/strong> focuses on components and connections, not the overall operation of the circuit.<\/li>\n<li data-section-id=\"16k3wuf\" data-start=\"958\" data-end=\"1032\"><strong data-start=\"960\" data-end=\"991\">Requires test point design:<\/strong> PCBs must include test points for ICT.<\/li>\n<li data-section-id=\"1c4zqo0\" data-start=\"1033\" data-end=\"1130\"><strong data-start=\"1035\" data-end=\"1068\">Less suitable for low volume:<\/strong> not cost-effective for prototypes or small production runs.<\/li>\n<\/ul>\n<h2 data-start=\"53\" data-end=\"108\"><span class=\"ez-toc-section\" id=\"5_How_is_ICT_different_from_other_testing_methods\"><\/span><strong data-start=\"53\" data-end=\"108\">5. How is ICT different from other testing methods?<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h2>\n<figure id=\"attachment_1949\" aria-describedby=\"caption-attachment-1949\" style=\"width: 1125px\" class=\"wp-caption aligncenter\"><img loading=\"lazy\" decoding=\"async\" class=\"size-full wp-image-1949\" src=\"https:\/\/makipos.com\/wp-content\/uploads\/2026\/03\/differences-between-ict-and-other-testing-methods.webp\" alt=\"Differences Between ICT and Other Testing Methods\" width=\"1125\" height=\"421\" srcset=\"https:\/\/makipos.com\/wp-content\/uploads\/2026\/03\/differences-between-ict-and-other-testing-methods.webp 1125w, https:\/\/makipos.com\/wp-content\/uploads\/2026\/03\/differences-between-ict-and-other-testing-methods-300x112.webp 300w, https:\/\/makipos.com\/wp-content\/uploads\/2026\/03\/differences-between-ict-and-other-testing-methods-1024x383.webp 1024w, https:\/\/makipos.com\/wp-content\/uploads\/2026\/03\/differences-between-ict-and-other-testing-methods-768x287.webp 768w\" sizes=\"auto, (max-width: 1125px) 100vw, 1125px\" \/><figcaption id=\"caption-attachment-1949\" class=\"wp-caption-text\">Differences Between ICT and Other Testing Methods<\/figcaption><\/figure>\n<p data-start=\"110\" data-end=\"293\">In PCBA manufacturing, ICT is often used together with other testing methods such as Functional Test (FCT) and Flying Probe. Each method has different purposes and testing approaches.<\/p>\n<p data-start=\"295\" data-end=\"341\">The table below provides a clearer comparison:<\/p>\n<div class=\"TyagGW_tableContainer\">\n<div class=\"group TyagGW_tableWrapper flex flex-col-reverse w-fit\" tabindex=\"-1\">\n<table class=\"w-fit min-w-(--thread-content-width)\" style=\"width: 100%;\" data-start=\"343\" data-end=\"1074\">\n<thead data-start=\"343\" data-end=\"423\">\n<tr data-start=\"343\" data-end=\"423\">\n<th data-start=\"343\" data-end=\"354\" data-col-size=\"sm\"><strong>Criteria<\/strong><\/th>\n<th data-start=\"354\" data-end=\"378\" data-col-size=\"md\"><strong>ICT (In-Circuit Test)<\/strong><\/th>\n<th data-start=\"378\" data-end=\"402\" data-col-size=\"sm\"><strong>FCT (Functional Test)<\/strong><\/th>\n<th data-start=\"402\" data-end=\"423\" data-col-size=\"sm\"><strong>Flying Probe Test<\/strong><\/th>\n<\/tr>\n<\/thead>\n<tbody data-start=\"503\" data-end=\"1074\">\n<tr data-start=\"503\" data-end=\"635\">\n<td style=\"width: 16.3327%;\" data-start=\"503\" data-end=\"520\" data-col-size=\"sm\"><strong>Test objective<\/strong><\/td>\n<td style=\"width: 27.7555%;\" data-col-size=\"md\" data-start=\"520\" data-end=\"555\">Check components and connections<\/td>\n<td style=\"width: 27.1543%;\" data-col-size=\"sm\" data-start=\"555\" data-end=\"593\">Check overall circuit functionality<\/td>\n<td style=\"width: 27.8557%;\" data-col-size=\"sm\" data-start=\"593\" data-end=\"635\">Check basic components and connections<\/td>\n<\/tr>\n<tr data-start=\"636\" data-end=\"701\">\n<td style=\"width: 16.3327%;\" data-start=\"636\" data-end=\"649\" data-col-size=\"sm\"><strong>Test level<\/strong><\/td>\n<td style=\"width: 27.7555%;\" data-start=\"649\" data-end=\"667\" data-col-size=\"md\">Component level<\/td>\n<td style=\"width: 27.1543%;\" data-start=\"667\" data-end=\"682\" data-col-size=\"sm\">System level<\/td>\n<td style=\"width: 27.8557%;\" data-start=\"682\" data-end=\"701\" data-col-size=\"sm\">Component level<\/td>\n<\/tr>\n<tr data-start=\"702\" data-end=\"805\">\n<td style=\"width: 16.3327%;\" data-start=\"702\" data-end=\"717\" data-col-size=\"sm\"><strong>Stage of use<\/strong><\/td>\n<td style=\"width: 27.7555%;\" data-col-size=\"md\" data-start=\"717\" data-end=\"734\">After assembly<\/td>\n<td style=\"width: 27.1543%;\" data-col-size=\"sm\" data-start=\"734\" data-end=\"767\">After final product completion<\/td>\n<td style=\"width: 27.8557%;\" data-col-size=\"sm\" data-start=\"767\" data-end=\"805\">Prototype or low-volume production<\/td>\n<\/tr>\n<tr data-start=\"806\" data-end=\"951\">\n<td style=\"width: 16.3327%;\" data-start=\"806\" data-end=\"825\" data-col-size=\"sm\"><strong>Defect detection<\/strong><\/td>\n<td style=\"width: 27.7555%;\" data-start=\"825\" data-end=\"871\" data-col-size=\"md\">Component, soldering and connection defects<\/td>\n<td style=\"width: 27.1543%;\" data-col-size=\"sm\" data-start=\"871\" data-end=\"909\">Functional and system logic defects<\/td>\n<td style=\"width: 27.8557%;\" data-col-size=\"sm\" data-start=\"909\" data-end=\"951\">Basic connection and soldering defects<\/td>\n<\/tr>\n<tr data-start=\"952\" data-end=\"991\">\n<td style=\"width: 16.3327%;\" data-start=\"952\" data-end=\"965\" data-col-size=\"sm\"><strong>Test speed<\/strong><\/td>\n<td style=\"width: 27.7555%;\" data-col-size=\"md\" data-start=\"965\" data-end=\"972\">Fast<\/td>\n<td style=\"width: 27.1543%;\" data-col-size=\"sm\" data-start=\"972\" data-end=\"981\">Medium<\/td>\n<td style=\"width: 27.8557%;\" data-col-size=\"sm\" data-start=\"981\" data-end=\"991\">Slower<\/td>\n<\/tr>\n<tr data-start=\"992\" data-end=\"1074\">\n<td style=\"width: 16.3327%;\" data-start=\"992\" data-end=\"1010\" data-col-size=\"sm\"><strong>Investment cost<\/strong><\/td>\n<td style=\"width: 27.7555%;\" data-start=\"1010\" data-end=\"1036\" data-col-size=\"md\">High (requires fixture)<\/td>\n<td style=\"width: 27.1543%;\" data-start=\"1036\" data-end=\"1045\" data-col-size=\"sm\">Medium<\/td>\n<td style=\"width: 27.8557%;\" data-start=\"1045\" data-end=\"1074\" data-col-size=\"sm\">Low (no fixture required)<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<\/div>\n<p data-start=\"1076\" data-end=\"1290\">ICT does not replace other testing methods but is often used together with them. While ICT helps detect defects at the component and assembly level, FCT ensures the product works correctly in real-world conditions.<\/p>\n<h2 data-start=\"50\" data-end=\"81\"><span class=\"ez-toc-section\" id=\"6_When_should_ICT_be_used\"><\/span>6. When should ICT be used?<span class=\"ez-toc-section-end\"><\/span><\/h2>\n<p data-start=\"83\" data-end=\"248\">In-Circuit Testing (ICT) is typically used after PCBA assembly, especially when fast testing and early detection of component and manufacturing defects are required.<\/p>\n<p data-start=\"250\" data-end=\"289\">ICT is suitable in the following cases:<\/p>\n<ul data-start=\"291\" data-end=\"855\">\n<li data-section-id=\"85c4s4\" data-start=\"291\" data-end=\"398\"><strong data-start=\"293\" data-end=\"320\">High-volume production:<\/strong> ICT enables fast and accurate testing, making it ideal for mass production.<\/li>\n<li data-section-id=\"1t79rr5\" data-start=\"399\" data-end=\"529\"><strong data-start=\"401\" data-end=\"427\">Stable product design:<\/strong> when the PCB design does not change frequently, investing in a fixture becomes more cost-effective.<\/li>\n<li data-section-id=\"vor4fi\" data-start=\"530\" data-end=\"641\"><strong data-start=\"532\" data-end=\"559\">Early defect detection:<\/strong> helps identify component, soldering and connection issues right after assembly.<\/li>\n<li data-section-id=\"tr41ke\" data-start=\"642\" data-end=\"764\"><strong data-start=\"644\" data-end=\"676\">High testing speed required:<\/strong> ICT can test multiple points on the PCB at the same time, reducing overall test time.<\/li>\n<li data-section-id=\"1jkabne\" data-start=\"765\" data-end=\"855\"><strong data-start=\"767\" data-end=\"800\">Test points available on PCB:<\/strong> the board must be designed with test points for ICT.<\/li>\n<\/ul>\n<p data-start=\"857\" data-end=\"987\">ICT is often used together with other methods such as FCT to ensure product quality at both the component and functional levels.<\/p>\n<h2 data-start=\"50\" data-end=\"64\"><span class=\"ez-toc-section\" id=\"Conclusion\"><\/span><strong data-start=\"50\" data-end=\"64\">Conclusion<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h2>\n<p data-start=\"66\" data-end=\"349\">In-Circuit Testing (ICT) is an important testing method in PCBA manufacturing, helping quickly detect defects related to components and the assembly process. With its ability to provide accurate testing at the component level, ICT helps reduce errors early in the production process.<\/p>\n<p data-start=\"351\" data-end=\"548\">Although it cannot verify the overall functionality of the circuit, ICT still plays a fundamental role and is often used together with other methods such as FCT to ensure overall product quality.<\/p>\n","protected":false},"excerpt":{"rendered":"<p>In PCB manufacturing, post-assembly testing plays a critical role in ensuring product quality. In-Circuit Testing (ICT) is one of the most widely used methods for quickly and accurately checking components and connections on a circuit board. As a result, ICT can detect defects early in the production process before the board moves on to further [&hellip;]<\/p>\n","protected":false},"author":1,"featured_media":1951,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[18],"tags":[],"class_list":["post-1946","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-industry-news"],"acf":[],"_links":{"self":[{"href":"https:\/\/makipos.com\/wp-json\/wp\/v2\/posts\/1946","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/makipos.com\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/makipos.com\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/makipos.com\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/makipos.com\/wp-json\/wp\/v2\/comments?post=1946"}],"version-history":[{"count":2,"href":"https:\/\/makipos.com\/wp-json\/wp\/v2\/posts\/1946\/revisions"}],"predecessor-version":[{"id":1952,"href":"https:\/\/makipos.com\/wp-json\/wp\/v2\/posts\/1946\/revisions\/1952"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/makipos.com\/wp-json\/wp\/v2\/media\/1951"}],"wp:attachment":[{"href":"https:\/\/makipos.com\/wp-json\/wp\/v2\/media?parent=1946"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/makipos.com\/wp-json\/wp\/v2\/categories?post=1946"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/makipos.com\/wp-json\/wp\/v2\/tags?post=1946"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}